QFN QFN QFN semiconductor package method of fabricating the same and mask sheet for manufacturing the same

摘要

The present invention provides excellent die bondability and wire bondability, and can effectively suppress leakage of encapsulation resin, thereby increasing the reliability and productivity of the QFN semiconductor package, and a manufacturing method thereof, and a QFN semiconductor package. The present invention relates to a mask sheet for manufacturing a package, wherein the QFN semiconductor package according to the present invention is manufactured by forming a contact depth on an adhesive layer of a mask sheet through a lamination process of imprinting a lead frame on the mask sheet.