TAIKO WAFER PROTECTING TAPE, AND TAIKO WAFER PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a TAIKO wafer protecting tape, which is adhered at the time of performing an electroless plating treatment to a TAIKO wafer polished only at an inner side region while leaving a periphery, and a TAIKO wafer processing method using said TAIKO wafer protecting tape.SOLUTION: A TAIKO wafer protecting tape is applied to a TAIKO wafer which has been polished only at the region of an inner side while leaving a periphery, thereby to protect the TAIKO wafer at an electroless plating treatment time. The TAIKO wafer protecting tape is composed of a substrate and an adhesive layer formed on one face of the substrate. The substrate has a 5% tension strength of 60 MPa or less, and a water vapor permeability measured by the Lyssy method conforming to JIS K7129 is 3 g/mday or less.SELECTED DRAWING: None