Adhesive tape for protecting semiconductor wafer surface and method for processing semiconductor wafer

摘要

A pressure-sensitive adhesive tape for protecting a semiconductor wafer surface, which is used by heating and bonding at a temperature of 40 ° C. to 90 ° C. on a surface of a semiconductor wafer having an unevenness of 20 μm or more, wherein the pressure-sensitive adhesive tape for protecting a semiconductor wafer surface comprises a substrate A film, a pressure-sensitive adhesive layer, and an intermediate resin layer between the base film and the pressure-sensitive adhesive layer, wherein the thickness of the intermediate resin layer is equal to or greater than the unevenness difference, and constitutes the intermediate resin layer. Adhesive for protecting the surface of a semiconductor wafer, wherein the melting point or the Vicat softening point of the resin to be formed is 40 ° C. to 90 ° C., and the melt mass flow rate of the resin constituting the intermediate resin layer is 10 g / min to 100 g / min. Of processing a semiconductor wafer using the method.