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Surface Finishing Technology and Semiconductor Fabrication Process. Drying Technology for Silicon Wafer in Semiconductor Manufacturing.

机译：表面精加工技术和半导体制造工艺。半导体制造中硅晶片的干燥技术。

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Cozy BAN; Kazunao SATO;
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年度 1998
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1. SURFACE TECHNOLOGY FOR FABRICATING GALLIUM NITRIDE-DIAMOND-BASED SEMICONDUCTOR WAFERS [J] . Firooz Faili Advanced Coatings & Surface Technology . 2012,第4期

机译：制造氮化镓-金刚石基半导体晶片的表面技术
2. Erratum: 'Fabrication of High-Sensitivity Polycrystalline Silicon Nanowire Field-Effect Transistor pH Sensor Using Conventional Complementary Metal-Oxide-Semiconductor Technology' [Jpn. J. Appl. Phys. 50, 04DL05 (2011)] [J] . Chen Hou-Yu, Lin Chia-Yi, Chen Min-Cheng, Japanese journal of applied physics . 2018,第5期

机译：勘误表：“使用传统的互补金属氧化物半导体技术制造高灵敏度多晶硅纳米线场效应晶体管pH传感器”。 J.应用物理50，04DL05（2011）]
3. Fabrication of High-Sensitivity Polycrystalline Silicon Nanowire Field-Effect Transistor pH Sensor Using Conventional Complementary Metal-Oxide-Semiconductor Technology [J] . Hou-Yu Chen, Chia-Yi Lin, Min-Cheng Chen, Japanese journal of applied physics . 2011,第4ISSUE2期

机译：使用传统的互补金属氧化物半导体技术制备高灵敏度多晶硅纳米线场效应晶体管pH传感器
4. The Use of Magnetorheological Finishing (MRF) to Relieve Residual Stress and Subsurface Damage on Lapped Semiconductor Silicon Wafers [C] . Steven R. Arrasmith, Stephen D. Jacobs, John C. Lambropoulos, Society of Photo-Optical Instrumentation Engineers Conference on Optical Manufacturing and Testing . 2001

机译：使用磁流学精加工（MRF）来减轻叠加半导体硅晶片的残余应力和地下损伤
5. Molecular mechanics and ab initio simulations of silicon (111) surface reconstructions, semiconductors and semiconductor superlattices, hydrogen abstraction for nanotechnology, polysilane, and growth of CVD diamond. [D] . Musgrave, Charles Bruce. 1995

机译：硅（111）表面重建，半导体和半导体超晶格，纳米技术的氢提取，聚硅烷和CVD金刚石生长的分子力学和从头算模拟。
6. Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology [O] . Sten Vollebregt, Ryoichi Ishihara 2015

机译：兼容半导体技术的低温碳纳米管垂直互连件的制造
7. Surface Finishing Technology and Semiconductor Fabrication Process. Wet Cleaning Technology for Silicon Wafer. [O] . Koji IZUNOME 1998

机译：表面精加工技术和半导体制造工艺。硅晶片的湿式清洁技术。
8. Semiconductor Measurement Technology: Automatic Determination of the Interstitial Oxygen Content of Silicon Wafers Polished on Both Sides [R] . Gladden, W. K. , Slaughter, S. R. , Duncan, W. M. , 1988

机译：半导体测量技术：自动测定双面抛光硅晶片的间隙氧含量

Surface Finishing Technology and Semiconductor Fabrication Process. Drying Technology for Silicon Wafer in Semiconductor Manufacturing.

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