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Collective fabrication of all-organic microcantilever chips based on a hierarchical combination of shadow-masking and wafer-bonding processing methods

机译：基于阴影掩模和晶片键合处理方法的分层组合的集体制造全有机微电子芯片

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Georges Dubourg; Ludivine Fadel-Taris; Isabelle Dufour; Claude Pellet; Cédric Ayela;
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年度 2011
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1. Collective fabrication of all-organic microcantilever chips based on a hierarchical combination of shadow-masking and wafer-bonding processing methods [J] . Georges Dubourg, Ludivine Fadel-Taris, Isabelle Dufour, Journal of Micromechanics and Microengineering . 2011,第9期

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2. Fabrication of a microcantilever-based aerosol detector with integrated electrostatic on-chip ultrafine particle separation and collection [J] . Bertke Maik, Xu Jiushuai, Setiono Andi, Journal of Micromechanics and Microengineering . 2020,第1期

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3. An asynchronous hierarchical router for networks-on-chip-based three-dimensional multi-processor system-on-chip [J] . Walid Lafi, Didier Lattard, Ahmed Jerrya Software . 2012,第7期

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4. Fabrication of Three-dimensional Human Tissue Chips by Combination of Inkjet Cell Printing and Hierarchical Cell Manipulation [C] . Yasushi Takamura, Kayo Sakaue, Michiya Matsusaki, Society for Biomaterials annual meeting and exposition . 2014

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5. Novel processing methods based on the twin screw extrusion platform: Flowability control and reactive extrusion, development of hybrid methods with electrospinning and fabrication of graded nanobursa* meshes. [D] . Senturk-Ozer, Semra. 2012

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6. An on-demand bench-top fabrication process for fluidic chips based on cross-diffusion through photopolymerization [O] . Takumi Kimoto, Kou Suzuki, Takashi Fukuda, 2020

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7. Two-dimensional X-ray waveguides: fabrication by wafer-bonding process and characterization [O] . 2008

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Collective fabrication of all-organic microcantilever chips based on a hierarchical combination of shadow-masking and wafer-bonding processing methods

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