Selective Laser Sintering (SLS), as a Solid Freeform Fabrication (SFF) technique, has been used as a component manufacturing method, specifically for components used to handle silicon wafers in the microelectronics industry. The most common materials for these components are quartz and silicon carbide. Both materials have been studied in this work.; In this dissertation, first the feasibility of direct SLS of quartz powder for quartz carriers manufacturing was examined. Single and multiple layer experiments were conducted and multilayer samples were made without the use of a polymer binder.; Second, laser polishing of quartz-slot surfaces was thoroughly studied. These slots were mechanically cut into the quartz rod, which is the main component of the quartz boat. The polishing related parameters were optimized and surface roughness was measured before and after laser polishing. Surface finishing is a critical and for some applications, limiting feature of parts produced using SFF. SLS uses a laser and scanning system, so the possibility of laser polishing SFF parts is a logical approach to the surface finish improvement. Laser polishing is applicable to a various types of material with complex shapes.; Third, a novel liquid silicon pressureless infiltration technique for the production of silicon matrix composites containing silicon carbide particulates reinforcement was researched. SLS of silicon carbide preforms, as a net-shape forming process, combined with liquid silicon pressureless infiltration (often called spontaneous infiltration), offers an alternative route to the synthesis of fully dense composites with good geometric and dimensional fidelity. Under appropriate experimental conditions, such as infiltration atmosphere, temperature and duration, successful silicon infiltration was achieved. Physical, thermal and mechanical properties of the infiltrated parts were studied and results were discussed.
展开▼
