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Method and apparatus for processing flat substrates, especially silicone wafers for producing microelectronic components
Method and apparatus for processing flat substrates, especially silicone wafers for producing microelectronic components
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机译：用于处理扁平基板，尤其是用于生产微电子元件的硅晶片的方法和设备
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摘要
The invention relates to a method and to a device for treating tabular substrates (5) according to which said substrate (5) is arranged in a narrow gap (62) between two plates (60, 61).
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