PROCESSING METHOD FOR TAIKO WAFER

摘要

PROBLEM TO BE SOLVED: To provide a processing method for a TAIKO wafer capable of exfoliating a protective tape with no adhesive residue, by preventing warpage of the TAIKO (registered trade mark) wafer reliably even when the TAIKO wafer, where only an inside area is ground while leaving a periphery, is subjected to sputtering.;SOLUTION: A processing method has a taping step of sticking a wafer protective tape 1 having a base material 12 and a curable pressure sensitive adhesive layer 11 containing a curable adhesive to a non-ground surface of a TAIKO wafer 2 that is ground at only an inside area while leaving a periphery, a tape hardening step of hardening the wafer protective tape 1 by giving stimulation thereto, a sputtering step of sputtering the TAIKO wafer 2 to which the wafer protective tape 1 is stuck, and a tape exfoliation step of exfoliating the wafer protective tape 1 from the TAIKO wafer 2 subjected to sputtering.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT