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A method for measuring the orientation of a single crystal wafer using high-resolution X-ray rocking curve measurement
A method for measuring the orientation of a single crystal wafer using high-resolution X-ray rocking curve measurement
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机译:一种使用高分辨率X射线摇摆曲线测量来测量单晶晶片取向的方法
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摘要
Provided is a method of determining a surface orientation of a single crystal wafer. The method of determining a surface orientation of a single crystal wafer using high resolution X-ray rocking curve measurement may determine a surface angle of the wafer and a direction of the surface angle using rocking curve measurement of a high resolution X-ray diffraction method and measuring a misalignment angle formed by a rotation axis of a measuring apparatus and a surface normal of the wafer and an orientation of the misalignment angle.
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