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DETERMINATION METHOD OF SURFACE ORIENTATION OF SINGLE CRYSTAL WAFER USING HIGH RESOLUTION X-RAY ROCKING CURVE MEASUREMENT
DETERMINATION METHOD OF SURFACE ORIENTATION OF SINGLE CRYSTAL WAFER USING HIGH RESOLUTION X-RAY ROCKING CURVE MEASUREMENT
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机译:高分辨率X射线摇摆曲线测定单晶晶片表面取向的方法
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摘要
The present invention relates to a determination method of the surface orientation of a single crystal wafer. More particularly, the present invention relates to a determination method of the surface orientation of a single crystal wafer using high resolution X-ray rocking curve measurement capable of measuring an eccentric angle and direction between the rotation axis of measurement equipment and the surface vertical axis of a wafer by determining the surface angle of the wafer and the direction of the surface angle using the high resolution X-ray rocking curve measurement.;COPYRIGHT KIPO 2014
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