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Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication
Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication
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机译:用于无芯封装和具有嵌入式互连桥的封装的双面阻焊层及其制造方法
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摘要
A coreless package substrate with dual side solder resist layers is disclosed. The coreless package substrate has a top side and a bottom side opposite of the top side and includes a single build-up structure formed of at least one insulating layer, at least one via, and at least one conductive layer. The coreless package substrate also includes a bottom plurality of contact pads on the bottom side, and a top plurality of contact pads on the top side. A bottom solder resist layer is on the bottom side, and a top solder resist layer is on the top side. The concept of dual side solder resist is extended to packages with interconnect bridge with C4 interconnection pitch over a wide range.
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