INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

摘要

A method of forming a wafer level packaged circuit device ,the method comprising forming a device wafer, forming a cap wafer,forming a cap wafer, forming,on either, one or more material layers used in the formation of either the cap wafer or the device wafer, and left remaining in a region of a substrate of either the cap wafer or the device wafer, and bonding the cap wafer to the device wafer.