- BARRIER CHEMICAL MECHANICAL PLANARIZATION SLURRIES USING CERIA-COATED SILICA ABRASIVES

摘要

A chemical mechanical planarization (CMP) polishing composition comprising composite particles, such as ceria coated silica particles, provides adjustable abrasion selectivity values between different films. The composition allows a high removal rate for interconnect metal and silicon oxide dielectrics while providing a polish stop on low-K dielectrics, a-Si and tungsten films. The chemical mechanical planarization (CMP) polishing composition exhibited excellent performance using a soft polishing pad.