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BARRIER CHEMICAL MECHANICAL PLANARIZATION SLURRIES USING CERIA-COATED SILICA ABRASIVES
BARRIER CHEMICAL MECHANICAL PLANARIZATION SLURRIES USING CERIA-COATED SILICA ABRASIVES
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机译:使用氧化铈包覆的二氧化硅磨料的屏障化学机械平面化浆液
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摘要
Chemical Mechanical Planarization (CMP) polishing compositions comprising composite particles, such as ceria coated silica particles, offer tunable polishing removal selectivity values between different films. Compositions enable high removal rates on interconnect metal and the silicon oxide dielectric while providing a polish stop on low-K dielectrics, a-Si and tungsten films. Chemical Mechanical Planarization (CMP) polishing compositions have shown excellent performance using soft polishing pad.
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