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RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATED BOARD, RESIN SHEET, AND PRINTED CIRCUIT BOARD

机译:树脂成分,预浸料,金属箔层压板,树脂板和印刷电路板

摘要

A resin composition containing:an epoxy resin (A) represented by the following formula (1); anda cyanate compound (B), wherein Ar represents a polycyclic aromatic group, R represents a hydrogen atom or a methyl group, G represents a glycidyl group, and n represents an integer of 0 to 15.
机译:树脂组合物,其包含:下式(1)表示的环氧树脂(A);和氰酸酯化合物(B), <图像文件=“ IMGA0001.GIF” he =“ 17” imgContent =“ chem” imgFormat =“ GIF” wi =“ 94” /> 其中Ar代表多环芳族基团,R表示氢原子或甲基,G表示缩水甘油基,n表示0至15的整数。

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