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RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATED BOARD, RESIN COMPOSITE SHEET, AND PRINTED CIRCUIT BOARD

机译:树脂组合物,预浸料,金属箔层压板,树脂复合板和印刷电路板

摘要

A resin composition comprising one or more cyanate compounds (A) selected from a group consisting of a naphthol aralkyl-based cyanate compound, a naphthylene ether-based cyanate compound, a xylene resin-based cyanate compound, a trisphenolmethane-based cyanate compound, and an adamantane skeleton-based cyanate compound; a polymaleimide compound (B) represented by general formula (1); and a filler (C).
机译:一种树脂组合物,其包含一种或多种选自萘酚芳烷基基氰酸酯化合物,萘醚基氰酸酯化合物,二甲苯树脂基氰酸酯化合物,三酚甲烷基氰酸酯化合物的氰酸酯化合物(A),和金刚烷骨架基氰酸酯化合物;通式(1)表示的聚马来酰亚胺化合物(B)。和填料(C)。

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