BT resin laminate for high heat resistant multilayer printed circuit boards

摘要

It is undeniable that highly integrated semi-conduction and high density packaging technology have greatly contributed to the progress of today's electronics industry. We have developed a process for manufacturing high heat resistant and high density multilayer printed circuit boards (MLPCB) from BT Resin. BT Resin offers excellent high heat resistance and dielectric properties. It also exhibits outstanding performance when it is used as a laminate component. Discussed in this paper are: characteristics of BT materials, a process for the chemical treatment of copper foil, drilling property, and dimensional stability of a new type of glass fabrics. The reliability of BT Resin MLPCB has been confirmed.