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PROCESS FOR PRODUCING A STRAINED LAYER BASED ON GERMANIUM-TIN

机译:基于锗锡的应变层的制备方法

摘要

The invention pertains to a process for producing a strained layer based on germanium-tin (GeSn). The process includes a step of producing a semiconductor stack containing a layer based on GeSn and having an initial strain value that is non-zero; a step of structuring the semiconductor stack so as to form a structured portion and a peripheral portion, the structured portion including a central section linked to the peripheral portion by at least two lateral sections having an average width greater than an average width of the central section; and a step of suspending the structured portion, the central section then having a final strain value higher than the initial value.
机译:本发明涉及一种用于生产基于锗-锡(GeSn)的应变层的方法。该工艺包括以下步骤:制造半导体堆叠,该半导体堆叠包含基于GeSn的层并且初始应变值为非零;构造半导体堆叠体以形成结构化部分和外围部分的步骤,该结构化部分包括通过至少两个侧向部分链接到外围部分的中心部分,该至少两个侧向部分的平均宽度大于中心部分的平均宽度;以及悬挂所述结构化部分的步骤,所述中央部分的最终应变值高于所述初始值。

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