首页> 外文会议>Integrated Circuit Design and Technology, 2005. ICICDT 2005. 2005 International Conference on >Study of process induced localized elevated oxygen concentration in strained boron doped sub-50 nm SiGeC base layers for high frequency npn HBTs
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Study of process induced localized elevated oxygen concentration in strained boron doped sub-50 nm SiGeC base layers for high frequency npn HBTs

机译:高频npn HBT的应变掺杂硼掺杂的50 nm以下SiGeC基层中过程诱导的局部升高的氧浓度的研究

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This work is believed to be the first report of localized elevated oxygen concentration (or pileup), which occurs with thermal anneals of strained, boron doped SiGeC layers. The thermally activated oxygen updiffusion is directly correlated to concentrations of germanium, carbon, and boron. A strong dependency on prebake temperature was also found. SIMS (secondary ion mass spectrometry) measurements were made to verify O, C, B, and Ge concentrations in SiGeC layers following low temp growth by LPCVD (low pressure chemical vapor deposition) and also following thermal anneal.
机译:据信这项工作是局部升高的氧浓度(或堆积)的第一个报告,这是在应变,掺硼的SiGeC层的热退火中发生的。热活化氧的向上扩散与锗,碳和硼的浓度直接相关。还发现了对预烘烤温度的强烈依赖性。进行SIMS(二次离子质谱)测量以验证在通过LPCVD(低压化学气相沉积)进行低温生长之后以及在进行热退火之后,SiGeC层中的O,C,B和Ge浓度。

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