SUBSTRATE POSITION COMPENSATING APPARATUS, SUBSTRATE POSITION COMPENSATING METHOD, SUBSTRATE PROCESSING APPARATUS HAVING SAME, AND SUBSTRATE PROCESSING METHOD HAVING SAME

摘要

According to exemplary embodiments of the present invention, a substrate position compensating apparatus, a substrate position compensating method, a substrate processing apparatus having the same, and a substrate processing method having the same can compensate for and identify a position on which a substrate is mounted through contact with the substrate when processing the substrate. Likewise, the present invention is possible to perform more exact position compensation because of being possible to identify the position on which the substrate is mounted through the contact with the substrate and is possible to sufficiently shorten process time because of being possible to automatically compensate for the position in accordance with a predetermined qualification.;COPYRIGHT KIPO 2019