BASE PLATE, SUBSTRATE ASSEMBLY, METHOD OF PROCESSING A SEMICONDUCTOR SUBSTRATE, APPARATUS FOR ASSEMBLING A BASE PLATE AND A SEMICONDUCTOR SUBSTRATE, LITHOGRAPHIC APPARATUS

摘要

It is an object of the present invention to provide an improved reproducibility of a clamping process of a substrate during a lithographic processing.According to a first aspect of the invention, there is provided a base plate configured to be attached to a semiconductor substrate, whereby the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate.and whereby a thickness of the base plate is in a range between 50% to 200% of a thickness of the semiconductor substrate.According to a second aspect of the invention, there is provided a substrate assembly comprising a semiconductor substrate and a base plate according to the first aspect of the invention,whereby the semiconductor substrate is attached to the base plate.According to a third aspect of the invention, there is provided a method of processing a semiconductor substrate, the method comprising:1.attaching the semiconductor substrate to a base platet;2.performing a sequence of processing steps on the semiconductor substrate while the semiconductor substrate remains attached to the base plate;3.detaching the base plate from the semiconductor substrate.According to a fourth aspect of the invention, there is provided an apparatus for attaching a base plate to a semiconductor substrate, the apparatus comprising:1.a support member configured to support a base plate;2.a transport unit configured to receive the semiconductor substrate and position the semiconductor substrate;3.a processing unit configured to releasably attach the semiconductor substrate to the base plate.