A method for manufacturing a photosensitive resin composition, a photosensitive resin film, a multilayer printed wiring board and a semiconductor package, and a multilayer printed wiring board.

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent via resolution, adhesive strength with plated copper and insulation reliability. A photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group, (B) an allyl group-containing nadiimide compound, and (C) a photopolymerization initiator. [Selection diagram] None