PALLADIUM-COATED COPPER BONDING WIRE, METHOD FOR PRODUCING PALLADIUM-COATED COPPER BONDING WIRE, WIRE JUNCTION STRUCTURE USING SAME, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SAME

摘要

A Pd-coated Cu bonding wire according to an embodiment of the present invention comprises 1.0-4.0 mass% of Pd and a total of 50 ppm by mass or less of sulfur group elements (5.0-12 ppm by mass of S, 5.0-20.0 ppm by mass of Se, and/or 15.0-50 ppm by mass of Te). The 100 crystal orientation in the crystal plane of a cross section of the wire is 15% or more, and the 111 crystal orientation is 50% or less. When a free air ball is formed on the wire and the tip part is analyzed, a Pd concentration area is observed on the surface thereof.