METHOD TO PROTECT DIE DURING METAL-EMBEDDED CHIP ASSEMBLY (MECA) PROCESS

摘要

A process for assembling microelectronic or semiconductor chips, comprising: providing a semiconductor chip having an active face with a connection pad; coating the active face of the semiconductor chip with a conformal dielectric material layer, such that the connection pad is completely coated by the conformal dielectric material layer; temporarily adhering the active face of the semiconductor chip to a carrier wafer; temporarily adhering the carrier wafer to a wafer-with-a-through-cavity such that the semiconductor chip extends into the through-cavity; assembling the semiconductor chip to the wafer-with-the-through-cavity by filling the through-cavity with a heat spreader material; releasing the assembled semiconductor chip and wafer-with-the-through-cavity from the carrier wafer; removing the conformal dielectric material layer from at least a portion of the connection pad; and forming an electrical connection to said at least a portion of the connection pad.