Embodiments of the present invention generally relate to a method and apparatus for plasma etching substrates, and more particularly, to a method and apparatus having protection for edges, sides and back surfaces of substrates being processed. Embodiments of the present invention provide an edge protection plate having an aperture smaller in size than the substrate being processed, where the edge protection plate can be located very close to the substrate in the plasma chamber. The edge protection plate overlaps the edges and / or sides of the substrate to provide protection for the edges, sides, and reflective coatings on the back side of the substrate.
展开▼
