chemical mechanical polishing apparatus for controlling polishing uniformity

摘要

A chemical mechanical polishing apparatus of the present invention includes: a polishing pad positioned on a polishing platen; a polishing head having a membrane holding a wafer positioned on the polishing pad and having a polishing slurry supply line capable of supplying polishing slurry; and a retainer ring installed on the circumference of the membrane to come in contact with the polishing pad so as to prevent the wafer from being separated and having polishing slurry supply holes connected to the polishing slurry supply line to supply the polishing slurry onto the polishing pad. Therefore, the chemical mechanical polishing apparatus can control the polishing uniformity of substance layers on the wafer.