SOLDERING PASTE CONTAINING LEAD-FREE SOLDER COMPOSITION WITH HIGH DUCTILITY AND SOLDERING FLOW

摘要

A solder paste comprising a lead-free solder composition and a soldering flux is claimed, the lead-free solder composition comprising: 0.02-6% by weight stibium, 0.03-3% by weight copper, 0.03-8% by weight Bismuth, 42-70% by weight indium, 0.3-8% by weight silver, 5-11% by weight magnesium, 0.8-1.6% by weight scandium, 0.7-2, 0 wt% yttrium and 10-45 wt% tin; and the soldering flux comprises: 25-32% by weight of rosin, 5-7% by weight of a mixture of pentanediazide and 2-fluorobenzoic acid as an organic acid activator; 0.2-0.5% by weight alkylphenol polyoxyethylene, as a surfactant; 0.7-0.8 wt% 1-octyl alcohol, as a defoamer; 0.5-0.7 wt% hydroquinone, as a stabilizer; and 20-32% by weight of a solvent based on monoalkyl propylene glycol.