Solder paste consisting of a lead-free solder composition with high ductility and a soldering flux

摘要

The present invention discloses a solder paste consisting of a lead-free solder composition and a soldering flux, wherein the lead-free solder composition 0,02 to 6 w -% stibium, 0,03 to 3 w -% copper, 0,03 to 8 w -% bismuth, 45 to 65 w -% indium, 0,3 to 8 w -% silver, 5 to 11 w -% magnesium, 0,6 to 1,2 w -% of scandium, 0,8 to 2,7 w -% zirconium and 10 to 45 w -% tin and the soldering flux 25 to 32 w -% of rosin, 5 to 7 w -% of a mixture of pentane diacid and 2 - fluorine benzoic acid above as organic acids - activator, 0,2 to 0,5 w -% polyoxyethylene alkylphenol - as a surface-active agent, 0,7 to 0,8 w -% 1 - octyl alcohol suitable defoaming agents, 0,5 to 0,7 w -% hydroquinone as a stabilizer, and 20 to 32 w -% of a mono alkyl - propylene glycol - based solvent contains.