Intrusive Reflow of Lead-free Solder Paste, Part II

摘要

Intrusive reflow describes the process of stencil printing solder paste in and around a thru-hole, placing SMT and thru-hole devices, then reflowing the entire assembly as part of the SMT process. This experiment is designed to determine the most effective parameters for successful ref low of acceptable lead-free thru-hole solder joints.