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A Method for Separating a Semiconductor Wafer into Individual Chips

机译：一种将半导体晶圆分离成单个芯片的方法

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作者
Litant, I.;
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年度 1969
页码 1-1
总页数 1
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Semiconductors (materials) ; Single crystals ; Wafers ; Pressure distribution ; Stresses ; Surface properties;

机译：半导体（材料）;单晶;晶圆;压力分布;应力;表面特性;

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8. A method for separating a semiconductor wafer into individual chips [R] . Litant, I. 1969

机译：一种将半导体晶片分离成单个芯片的方法

A Method for Separating a Semiconductor Wafer into Individual Chips

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