Method for forming chips i.e. semiconductor chips, with adhesive films, involves attaching adhesive film to rear of wafer, and separating wafer from adhesive film to obtain individual chips such that each chip is mounted on rear side film

摘要

The method involves attaching an adhesive film to a rear of a wafer (W) after performing a separation start dot-forming step. Multiple separation grooves in the adhesive film along the separation line are formed by applying a laser beam or by using a cutting blade. The film is attached to an extension of the adhesive film attached on the wafer. The sheet is expanded by applying an external force to the wafer. The wafer is separated from the adhesive film to obtain individual chips such that each chip is mounted on a rear side adhesive film.