Integrated circuit chip interconnect performance using anisotropically conducting adhesive films.

摘要

A detailed look at the present state-of-the-art in bare chip attachment materials is described in this document. This dissertation is based on a compilation of papers delivered to international conferences concerning electronic packaging. The subject matter is the performance of adhesive films for flip-chip bonding.;Adhesive flip-chip connections have been shown to offer low and reproducible initial interconnect resistance. This resistance remains stable through aggressive accelerating aging environments such as high temperature thermal, thermal cycling, and high temperature/high humidity conditions. The stability is related to the establishment of a pressure-engaged contact between chip and next level interconnect pads, compliance offered by conductive particles trapped between these pads (for certain applications), and resistance to degradation through high temperature, temperature cycling, or humidity exposure. The results of studies within the 3M laboratories compare very favorably with published reports available in the literature and with standard state-of-the-art solder reflow flip-chip attachment.