Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

摘要

The effects of different bonding temperatures during flip-chip-on-flex (FCOF) assembly in relation to the perfor- mance of anisotropic conductive adhesive (ACF) interconnect were investigated. Two types of flip chips were used in this study. It was found that Ni bumps formed better interconnections than bumpless FCOF packages. Aluminium oxide was observed and was thought to be the main cause of the increased in contact resistance after the moisture-soak tests. The conductive particles were not fully compressed by the bumps and pads and gaps were observed between the conductive particles and Cu pads in bumpless packages.