SEMICONDUCTOR WAFER, METHOD FOR SEPARATING THE SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP

摘要

A semiconductor wafer includes a first chip region and a second chip region spaced apart from each other by a scribe lane region. The semiconductor wafer also includes a test pad disposed in the scribe lane region. The semiconductor wafer additionally includes a protective layer partially covering the first chip region, the second chip region, and the scribe lane region, wherein the protective layer covers a portion of the test pad adjacent to the first chip region and leaves a remaining portion of the first test pad exposed.