Reliability Study of Beam Lead Sealed Junction Devices

摘要

Over 4000 beam lead sealed junction devices, of nine different types, both linear and digital and from four different manufacturers, were physically and electrically characterized. The devices were then sealed (in hermetic and nonhermetic packages) and were environmentally stressed under both operating and nonoperating conditions. Performance was determined and failures categorized according to type, class, complexity, manufacturer, package, and screen. (Author)