Nondestructive Evaluation of Metallized Tape Bonds Formed by Tape Automated Bonding (TAB)

摘要

This contract was one of two awarded to develop a new test for the nondestructive evaluation of metallurgical tape bonds which interconnect a VLSI/VHSIC chip to a microcircuit package or substrate. The process of forming the interconnections is known as Tape Automated bonding, or TAB. The accepted standard of nondestructive wire pull testing is difficult or impossible to apply to TAB furthermore, it may be subject to artifacts which cause severe interpretation problems. Experiments performed in this study demonstrated the utility of Scanning Laser Acoustic Microscopy (SLAM), in evaluating TAB bonds both at the site of the IC chip and at the site of the interconnection package and the results show excellent correlation to bond quality. Keywords: Tape automated bonding, Non-destructive evaluation of bonds; Very high speed integrated circuits (VHSIC), Very large scale integrated circuits, Tape wound construction. (jes)