首页> 外国专利> METAL SUPPORT FLEXIBLE BOARD, METAL SUPPORT CARRIER TAPE FOR TAPE AUTOMATED BONDING USING THE SAME, METAL SUPPORT FLEXIBLE CIRCUIT BOARD FOR MOUNTING LED, HEAT DISSIPATION METAL SUPPORT FLEXIBLE CIRCUIT BOARD AND COPPER FOIL-LAMINATED METAL SUPPORT FLEXIBLE CIRCUIT BOARD FOR FORMING CIRCUIT

METAL SUPPORT FLEXIBLE BOARD, METAL SUPPORT CARRIER TAPE FOR TAPE AUTOMATED BONDING USING THE SAME, METAL SUPPORT FLEXIBLE CIRCUIT BOARD FOR MOUNTING LED, HEAT DISSIPATION METAL SUPPORT FLEXIBLE CIRCUIT BOARD AND COPPER FOIL-LAMINATED METAL SUPPORT FLEXIBLE CIRCUIT BOARD FOR FORMING CIRCUIT

机译:金属支撑柔性板,用于使用相同胶带自动粘合的金属支撑带,用于安装LED的金属支撑柔性电路板,散热金属支撑柔性电路板和铜箔层压金属支撑柔性复合板

摘要

PROBLEM TO BE SOLVED: To provide a metal support flexible board facilitating bending formation and packaging design such as heat dissipation design while maintaining transportation strength and low curling properties enabling reel-to-reel processing.;SOLUTION: A metal support flexible board includes an adhesive layer (1) and a support (2). The support (2) is made of an aluminum foil having an elongation of 5% or more and a MIT bending proof stress of 35 times or more.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种金属支撑柔性板,该板有助于弯曲形成和包装设计(例如散热设计),同时保持运输强度和低卷曲特性,从而实现卷到卷加工。层(1)和支撑(2)。支撑件(2)由铝箔制成,该铝箔的伸长率为5%或以上,而MIT的弯曲耐弯曲应力为35倍或以上。;版权所有:(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2014192181A

    专利类型

  • 公开/公告日2014-10-06

    原文格式PDF

  • 申请/专利权人 TORAY IND INC;

    申请/专利号JP20130063413

  • 发明设计人 MAEDA AKIHIRO;ONO EIJI;SAWAMURA DAIJI;

    申请日2013-03-26

  • 分类号H01L21/60;H01L23/12;H05K1/02;H05K1/05;

  • 国家 JP

  • 入库时间 2022-08-21 16:17:34

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