Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration

Xiao Ming; Munief Walid Madhat; Wu Fengshun; Lilischkis Rainer; Oberbillig Tobias; Saumer Monika; Xia Weisheng

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Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration

机译：用于3D集成中电迁移研究的Cu-Sn-Ni-Cu互连微结构的制备和表征

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摘要

Purpose - The purpose of this paper is to fabricate a new Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration.

机译：目的-本文的目的是制造一种新的Cu-Sn-Ni-Cu互连微结构，用于3D集成中的电迁移研究。

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来源
《Soldering & Surface Mount Technology》 |2016年第2期|共10页
作者
Xiao Ming; Munief Walid Madhat; Wu Fengshun; Lilischkis Rainer; Oberbillig Tobias; Saumer Monika; Xia Weisheng;
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正文语种 eng
中图分类焊接一般性问题;
关键词
Photolithography; 3D integration; Cu pillars; Cu-Sn-Ni-Cu pillars; Electroplating; Interconnection microstructure;

机译：光刻;3D集成;Cu柱;Cu-Sn-Ni-Cu柱;电镀;微结构互连;

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专利

1. Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration [J] . Xiao Ming, Munief Walid Madhat, Wu Fengshun, Soldering & Surface Mount Technology . 2016,第2期

机译：用于3D集成中电迁移研究的Cu-Sn-Ni-Cu互连微结构的制备和表征
2. Study of microstructure evolution in novel Sn-Zn/Cu bi-layer and Cu/Sn-Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection [J] . Qingqian Li, Y.C. Chan, Kaili Zhang, Microelectronic Engineering . 2014,第juna期

机译：用于3D封装互连的新型纳米级Sn-Zn / Cu双层和Cu / Sn-Zn / Cu夹层结构的微观结构演变研究
3. Fabrication and characterization of freestanding 3D carbon microstructures using multi-exposures and resist pyrolysis [J] . Jung A. Lee, Seok Woo Lee, Kwang-Cheol Lee, Journal of Micromechanics and Microengineering . 2008,第3期

机译：使用多重曝光和抗热解的独立3D碳微结构的制造和表征
4. Study on 1/f~γ Noise Characterization of Metallic Interconnection Electromigration [C] . Liang HE, Lei DU, Yiqi ZHUANG Materials Research : Eco/enviromental materials, energy materials, magnesium, aerospace materials and biomaterials for medical application . 2009

机译：金属互连电迁移的1 / f〜γ噪声特征研究
5. Microstructure study of electroplated copper films for ULSI metal interconnections. [D] . Lee, Haebum. 2001

机译：用于ULSI金属互连的电镀铜膜的微观结构研究。
6. Development Modeling Fabrication and Characterization of a Magnetic Micro-Spring-Suspended System for the Safe Electrical Interconnection of Neural Implants [O] . Katharina Hoch, Frederick Pothof, Felix Becker, 2018

机译：磁性微弹簧悬挂系统的开发建模制造和表征用于神经植入物的安全电气互连
7. Study of microstructure evolution in novel Sn-Zn/Cu bi-layer and Cu/Sn-Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection [O] . Li Q, Chan YC, Zhang K, 2014

机译：用于3D封装互连的新型纳米级Sn-Zn / Cu双层和Cu / Sn-Zn / Cu夹层结构微观结构演变的研究

Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration

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