An interconnection test structure for evaluating more accurately and reliably electromigration characteristics is provided. The test structure includes an elongated metal test conductor having a first end and a second end, small extension metal conductors connected to the first end and the second end of the test conductor, and a plurality of vias disposed in the small extension metal conductors adjacent the first end and the second end of the test conductor. As a result, the current density of the plurality of vias is made to be less than the current density of the test conductor.
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