Accelerated Reliability Testing for Power Semiconductor Packages

摘要

Reliability of electronics is an essential condition for use in safety-relevant applications. Today's electronic components are built with an increasing number of different materials. Delamination of the molding compound at the chip-mold interface or chip-leadframe interface, a dominant failure mode during thermal cycling, can lead to complete malfunction of the component. Standard test procedures to prove the reliability are extremely time-consuming. End-of-life testing requirements force the development of accelerated reliability stress test concepts. New test procedures should be established to generate specific failure modes in a definitely shorter time. Especially during product development, these tests could be used to quickly find "weak areas" that are reliability relevant. This paper presents two examples for accelerated reliability testing to shorten product development cycles.