SEMICONDUCTOR PACKAGE CAPABLE OF GUARANTEEING THE RELIABILITY OF A TEST OPERATION AND A TEST SOCKET THEREOF

摘要

PURPOSE: A semiconductor package and a test socket thereof are provided to improve the reliability of a semiconductor package test using a connector which interlinks a first contact point and a second contact point which are exposed in a side of the semiconductor package.;CONSTITUTION: A trench(20) accepts a semiconductor package within housing. One or more probes are connected to the semiconductor package in the floor of the trench. A switching unit electrically interlinks a plurality of contact points which is exposed a side of the semiconductor package when inserting the semiconductor package into the trench. A test socket comprises a connector which is formed in the sidewall of the trench. The connector is projected from housing of the sidewall of the trench. The connector includes at least one among a vertical type connector, a horizontal type connector, and inclined type connector.;COPYRIGHT KIPO 2012