Reliability of Lead-free Solder Joints in WLCSP Device with Finite Element Simulation and Taguchi Method

摘要

In this paper, we research the thermo-mechanical reliability of lead-free solder joints in WLCSP assembly subjected to an accelerated thermal cyclic loading based on finite element simulation and Taguchi method. Effects of different control factors, including solder materials, height of solder ball, chip thickness and substrates thickness on the reliability of the lead-free solder joints were examined and calculated. The corner solder joint is the most critical solder joints in the assembly, the top surface of the solder joint is the crack propagated location. The optimal design in the WLCSP assembly has the combination of the SnAgCuAl, height of solder ball at 0.25 mm, chip thickness at 0.6 mm, substrate thickness at 1.0 mm. Moreover, the solder materials is the most important factor among the control factors in the WLCSP assembly.