Reliability of Pb-free solder joints in FCBGA using finite element simulation and Taguchi method

摘要

Thermo-mechanical reliability of containing Pb and Pb-free solder joints in FCBGA device subjected to an accelerated thermal cyclic loading was investigated based on finite element simulation and Taguchi method. Effects of different control factors on the reliability of the lead-free solder joints were anlyzed and calculated. The corner solder joint is the most critical solder joints in the ball array, the top surface of the solder joint is the crack propagated location. The optimal combination in FCBGA assembly show obvious enhancement effect on fatigue life of solder joints. Moreover, the solder material is the most important factor among the control factors in the FCBGA device.