Reliability issues of lead-free solder joints in electronic devices

机译：电子设备无铅焊点的可靠性问题

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Nan Jiang; Liang Zhang; Zhi-Quan Liu; Lei Sun; Wei-Min Long; Peng He; Ming-Yue Xiong; Meng Zhao;
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1. Reliability issues of lead-free solder joints in electronic devices [J] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, Science and technology of advanced materials . 2019,第1期

机译：电子设备无铅焊点的可靠性问题
2. Reliability study of industry Sn3.0Ag0.5Cu/Cu lead-free soldered joints in electronic packaging [J] . Lei Sun, Liang Zhang, Su-juan Zhong, Journal of materials science . 2015,第11期

机译：电子包装行业Sn3.0Ag0.5Cu / Cu无铅焊接接头的可靠性研究
3. Reliability behavior of lead-free solder joints in electronic components [J] . Liang Zhang, Ji-guang Han, Cheng-wen He, Journal of materials science . 2013,第1期

机译：电子元器件中无铅焊点的可靠性行为
4. Thermo-Mechanical Reliability of Nano-Silver Sintered Joints versus Lead-Free Solder Joints for Attaching Large-Area Silicon Devices [C] . Li Jiang, Kewei Xiao, Guo-quan Lu, CPES annual power electronics conference . 2011

机译：用于连接大面积硅器件的纳米银烧结接头与无铅焊点的热机械可靠性
5. Grain structure evolution of tin-based lead-free solder joints in electronic packaging assembly and its impacts on the fatigue reliability. [D] . Xu, Huili. 2013

机译：电子包装组件中锡基无铅焊点的晶粒结构演变及其对疲劳可靠性的影响。
6. Reliability issues of lead-free solder joints in electronic devices [O] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子设备中无铅焊点的可靠性问题
7. Fatigue Life Scatter of Lead-Free Solder Joints for Chip Components(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering) [O] . Hiroki MIYAUCHI, Qiang YU, Tadahiro SHIBUTANI 2009

机译：芯片组件无铅焊点的疲劳寿命散射（<特殊问题>电子设备和机械工程的热电机械可靠性）
8. Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies [R] . Vianco, P. , Rejent, J. , Artaki, I. , 1996

机译：无铅焊料与含铅表面处理的兼容性是电子组件中的可靠性问题

Reliability issues of lead-free solder joints in electronic devices

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