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首页> 外文期刊>Integrated Ferroelectrics >FERROELECTRIC PROPERTIES OF Pl PbZr_(0.53)Ti_(0.47)O_3 PbO Si (MFIS) STRUCTURES ACCORDING TO THE SUBSTRATE TEMPERATURE DURING THE PbO BUFFER LAYER DEPOSITION
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FERROELECTRIC PROPERTIES OF Pl PbZr_(0.53)Ti_(0.47)O_3 PbO Si (MFIS) STRUCTURES ACCORDING TO THE SUBSTRATE TEMPERATURE DURING THE PbO BUFFER LAYER DEPOSITION

机译:PbO缓冲层沉积过程中基体温度对Pl PbZr_(0.53)Ti_(0.47)O_3 PbO Si(MFIS)结构的铁电性能的影响

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摘要

PbO and PZT thin films were deposited on the p-type (100) Si substrate by the r.f. magnetron sputtering method with PbO and Pb_(1.1)Zr_(0.53)Ti_(0.47)O_3 targets for the application of the Metal-Ferroelectric-Insulator-Semiconductor (MFIS) structure. The MFIS structures with the PbO buffer layer show the good electric properties including a high memory window and a low leakage current density. The maximum value of the memory window is 2.0 V under the applied voltage of 9 V for the Pt PZT (200 nm, 400 deg) PbO (80 nm) Si structures with the PbO buffer layer deposited at the substrate temperature of 300 deg.
机译:通过射频将PbO和PZT薄膜沉积在p型(100)Si衬底上。以PbO和Pb_(1.1)Zr_(0.53)Ti_(0.47)O_3为靶的磁控溅射方法在金属-铁电-绝缘体-半导体(MFIS)结构中的应用。具有PbO缓冲层的MFIS结构具有良好的电性能,包括高存储窗口和低漏电流密度。对于Pt PZT(200 nm,400度)PbO(80 nm)Si结构,在300°C的衬底温度下沉积PbO缓冲层的情况下,在9 V的施加电压下,存储器窗口的最大值为2.0V。

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