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首页> 外文期刊>Applied Surface Science >An XPS study and electrical properties of Pb1.1Zr0.53Ti0.47O3/PbO/Si (MRS) structures according to the substrate temperature of the PbO buffer layer
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An XPS study and electrical properties of Pb1.1Zr0.53Ti0.47O3/PbO/Si (MRS) structures according to the substrate temperature of the PbO buffer layer

机译:根据PbO缓冲层的衬底温度进行XPS研究和Pb1.1Zr0.53Ti0.47O3 / PbO / Si(MRS)结构的电性能

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摘要

PbO and PZT thin films were deposited on the p-type (10 0) Si substrate by the rf magnetron sputtering method with PbO and Pb1.1Zr0.53Ti0.47O3 targets for the application of the metal-ferroelectric-insulator-semiconductor (MFIS) structure. The MFIS structures with the PbO buffer layer show the good electric properties including a high memory window and a low leakage current density. The maximum value of the memory window is 2.0 V under the applied voltage of 9 V for the Pt/PZT (200 nm, 400 degrees C)/PbO (80 nm)/Si structures with the PbO buffer layer deposited at the substrate temperature of 300 T. From the X-ray photoelectron spectroscopy (XPS) results, we could confirm that the substrate temperature of PbO affects the chemical states of the interface between the PbO buffer layer and Si substrate, which results in the inter-diffusion of Pb and the formation of the intermediate phases (PbSiO3). And the existence of the undesired SiO2 layer, which is the low dielectric layer, was confirmed at the surface region of the Si substrate by the XPS depth profile analysis. (c) 2005 Elsevier B.V. All rights reserved.
机译:通过射频磁控溅射方法,使用PbO和Pb1.1Zr0.53Ti0.47O3靶,在p型(10 0)Si衬底上沉积PbO和PZT薄膜,用于金属铁电绝缘体半导体(MFIS)的应用结构体。具有PbO缓冲层的MFIS结构具有良好的电性能,包括高存储窗口和低漏电流密度。对于Pt / PZT(200 nm,400摄氏度)/ PbO(80 nm)/ Si结构,在衬底温度为20V的情况下沉积PbO缓冲层时,在施加9 V的电压下,存储器窗口的最大值为2.0 V 300T。从X射线光电子能谱(XPS)结果,我们可以确认PbO的衬底温度影响PbO缓冲层和Si衬底之间的界面的化学状态,从而导致Pb和Pb相互扩散。形成中间相(PbSiO3)。并且,通过XPS深度分布分析,在Si衬底的表面区域确认了低介电层即不希望的SiO 2层的存在。 (c)2005 Elsevier B.V.保留所有权利。

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