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首页> 外文期刊>Microelectronic Engineering >The effect of annealing temperature on the electrical properties of metal-ferroelectric (PbZr_(0.53)Ti_(0.47)O_3)-insulator (ZrO_2)-semiconductor (MFIS) thin-film capacitors
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The effect of annealing temperature on the electrical properties of metal-ferroelectric (PbZr_(0.53)Ti_(0.47)O_3)-insulator (ZrO_2)-semiconductor (MFIS) thin-film capacitors

机译:退火温度对金属铁电(PbZr_(0.53)Ti_(0.47)O_3)-绝缘体(ZrO_2)-半导体(MFIS)薄膜电容器的电性能的影响

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摘要

Metal-ferroelectric-insulator-semiconductor (MFIS) thin-film structures using PbZr_(0.53)Ti_(0.47)O_3 (PZT) as the ferroelectric layer and zirconium oxide (ZrO_2) as the insulator layer were fabricated in this work. The leakage current and the C-V memory window were measured for MFIS capacitors with the PZT layer annealed at temperatures of 400℃, 500℃, 600℃, 700℃. The dominant conduction mechanism of Al/PZT(290 nm)/ZrO_2(15 nm)/Si structure is Poole-Frenkel emission in the temperature range of 300-425 K. Under a sweep voltage of 6 V, the largest memory window of 1.31 V was obtained for 500℃-annealed samples. The memory window as a function of insulator thickness was also discussed. More serious charge injection is observed when the voltage was swept from negative to positive.
机译:本文以PbZr_(0.53)Ti_(0.47)O_3(PZT)作为铁电层和氧化锆(ZrO_2)作为绝缘体层,制作了金属铁电绝缘体半导体(MFIS)薄膜结构。测量了在400℃,500℃,600℃,700℃温度下退火的PZT层的MFIS电容器的泄漏电流和C-V记忆窗。 Al / PZT(290 nm)/ ZrO_2(15 nm)/ Si结构的主要传导机制是300-425 K温度范围内的Poole-Frenkel发射。在6 V的扫描电压下,最大存储窗口为1.31对500℃退火的样品获得V。还讨论了存储窗口与绝缘体厚度的关系。当电压从负扫到正时,观察到更严重的电荷注入。

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