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Individually Addressable, Submicrometer Band Electrode Arrays. 2. Electrochemical Characterization

机译:可单独寻址的亚微米级带状电极阵列。 2.电化学表征

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We report extensive cyclic voltammetric evaluation of gold submicrometer edge band electrodes with different widths, from 25.3 to 143.5 nm. Fabrication of these band electrodes from layers of gold and silicon nitride using conventional microfabrication techniques, was reported in the preceding companion paper. Gold film thicknesses and, thus, the electrode widths were measured by surface profilometry, X-ray interferometry, and atomic force microscopy. The electrodes exhibit typical sigmoidal-shaped cyclic voltammograms at slow scan rates (< 1 V/s). The limiting currents deviate from theoretical values as electrode width decreases. At larger widths, experimental values are in better agreement with theory, consistent with trends reported in the literature. Maximum current is much higher than expected for all widths at fast scan rates (> 25 V/s). Capacitance of the edge band electrodes is high (187-0.206 mF/cm↑2 for 71.2-nm edge band electrodes for scan rates of 0.010-204 V/s) and scan rate dependent. Values approach those of macroelectrodes at fast scan rates, indicating imperfect seals at the gold/ silicon nitride, gold/Cr/glass, or gold/epoxy interfaces.
机译:我们报告了具有不同宽度(从25.3至143.5 nm)的金亚微米边带电极的广泛循环伏安评估。在先前的伴随论文中报道了使用常规的微制造技术从金和氮化硅层制造这些带状电极。通过表面轮廓测定法,X射线干涉测定法和原子力显微镜法测量金膜的厚度,从而测定电极的宽度。电极在缓慢的扫描速率(<1 V / s)下显示出典型的S型循环伏安图。随着电极宽度的减小,极限电流偏离理论值。在较大的宽度上,实验值与理论更好地吻合,与文献报道的趋势一致。在快速扫描速率(> 25 V / s)下,所有宽度的最大电流都远高于预期。边缘带电极的电容较高(对于71.2 nm边缘带电极,扫描速度为0.010-204 V / s时为187-0.206 mF / cm↑2),并且取决于扫描速度。该值以快速扫描速率接近大电极的值,表明在金/氮化硅,金/铬/玻璃或金/环氧树脂界面处的密封不完善。

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