High-performance FCBGA based on multi-layer thin-substrate packaging technology

摘要

We developed a high-performance FCBGA (Flip-Chip all Grid Array) based on Multi-Layer Thin-Substrate (MLTS) Packaging Technology in order to meet the strong demand for high-density, high-performance, and low-cost LSI Packages. The important feature is that, only a high-density, high-performance multi-layer thin-substrate structure remains by removing a metal plate after mounting an LSI chip. We successfully developed a high-density FCBGA prototype based on our MLTS packaging technology. The prototype's excellent long-term reliability was also demonstrated through a series of tests conducted on it.