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Packaging Enhanced Optoelectronic Interconnects for Data Communications: High-performance Unidirectional Electrooptic Modulator Based on Polymeric Highly Multi-Mode Waveguides

机译:用于数据通信的封装增强型光电互连:基于聚合物高度多模波导的高性能单向电光调制器

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A unidirectional electro-optic modulator based on polymeric highly multi-mode waveguides was constructed using the standard VLSI techniques. A high unidirectional coupling efficiency of 100% was achieved. A high modulation depth of 99% was also experimentally achieved at 633nm wavelength. The modulator was packaging enhanced by vertically configuring the guiding multi-mode waveguide and the dumping planar waveguide. The device packing density improved by a factor of two. Based on the same configuration, a packaging enhanced polarization-insensitive thermo-optic was also built. The switch operating at wavelengths of 632.8nm and 1.3 micrometers has been demonstrated experimentally with extinction ratios of 21dB and 22dB, respectively. Such devices have an intrinsic wide optical bandwidth due to the large dynamic range of the phase- matching condition implied by the multi-mode waveguides. These devices can be used in optoelectronic interconnects for data communications.

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